Intel has launched its next-generation low-power data centre chip family, known as Xeon D. According to Intel, Xeon offers 1.7 times the performance per watt of its prior generation. Initial four- and eight-core products are available for micro-server workloads, with some additional products used for network storage coming in the second half of 2015. These parts integrate between four and eight Broadwell CPU cores, 2 x 10 GB Ethernet controllers, and 24 lanes of PCI Express 3.0 connectivity built-in Intel’s 14-nanometer technology. Intel includes Serial ATA 3.0, USB 3.0, and USB on the second chip. These initial products will be necessary for dedicated web hosting, dynamic web serving, and memory caching. They have more specialized workloads that can do more functions, like entry-level storage area networks, wireless base stations, and edge routers.

Xeon D: a competitive technology

Xeon dedicated servers are designed for customers who have less complex computing requirements. It helps those customers who want an average server load. Xeon is basically for e-commerce, database, and enterprise applications. The price depends on the users’ requirements. The subscription period is generally 3 to 12 months, according to the need. It can be renewed or changed by a user. These servers provide fast speed and outstanding performances at exceptional prices. It offers a Tyan Motherboard, 1024 Megabytes, 1000 GB of Transfer Inbound and Outbound, and an 80 GB SATA Hard Drive. Intel said that more than 50 systems are currently being designed based on new Xeon D processors. The company has a part whose codename is Denverton that would be built on the company’s 14-nanometer process on a more unique Atom core.

Xeon D as a Cloud Future:

Intel has launched an Atom-based product named Avoton processors to encounter a threat. This product is available at a meagre cost and for lower applications.

The Xeon D adopted the latest technology from Intel into a single package, designed for blade servers and other dense configurations with a single processor based on every computing node. The product is not a single chip, but two pieces of silicon sharing called a standard package. The package itself contains everything necessary for a complete server node. The company has planned to produce 50 billion devices by 2020, which will be power-efficient servers that can deliver information quickly.